TSMC (Taiwan Semiconductor Manufacturing Company) plans to expand capital expenditure in 2016 in a bid to accelerate the development of 10-nm and 7-nm process technologies as well as InFO WLP (Integrated Fan Out Wafer Level Packaging) technology, reported Commercial Times on November 23. The total amount of spending is estimated to top US$10 billion, said the report. At present, the company's Fab 12 has launched trial production of 10-nm chips while its Fab 15 is speeding up expansion of 10-nm production facilities, aiming to launch operation by end-2017 with a monthly capacity of 60,000 units.